Power Semiconductor Devices and Packages: Solder Mechanical Characterization and Lifetime Prediction

Pb-Free High Temperature Solder Joints for Power Semiconductor Devices

Three types of inexpensive Pb-free solder joints, namely Zn-based and Bi-based solders, and a CuSn alloy were studied for application to the high-temperature operation of wide band-gap power semiconductor devices using GaN or SiC. Zn– Al solder sheets, whose melting point is 380°C were prepared, and then surface oxides were removed by RF plasma etching. Subsequently, Cu thin films were deposite...

Lifetime prediction modeling of non-insulated TO-220AB packages with lead-based solder joints during power cycling

0026-2714/$ see front matter 2011 Elsevier Ltd. A doi:10.1016/j.microrel.2011.08.017 ⇑ Corresponding author at: STMicroelectronics, 16 7155, 37071 Tours Cedex 2, France. Tel.: +33 (0)2 47 01 34. E-mail address: [email protected] (S. Jacqu In this paper, a physical model is proposed to estimate the TRIAC solder joint fatigue during power cycling. The lifetime prediction is based on the fo...

Bayesian Prediction of SMART Power Semiconductor Lifetime with Bayesian Networks

In this paper Bayesian networks are used to predict complex semiconductor lifetime data. The data of interest is a mixture of two log-normal distributed heteroscedastic components where data is right censored. To understand the complex behavior of data corresponding to each mixture component, interactions between geometric designs, material properties and physical parameters of the semiconducto...

AN1907 Solder Reflow Attach Method for High Power RF Devices in Over-Molded Plastic Packages

The purpose of this application note is to provide Freescale Semiconductor customers with a guideline for solder reflow mounting of high power RF transistors and integrated circuits in over-molded plastic (OMP) packages. This document will aid customers in developing an assembly process suitable for their design as well as their manufacturing operation. Each Power Amplifier (PA) design has its ...

Power Semiconductor Devices